Osteoconductivity in a Minimally Invasive Design 

Indicated for use as an MIS or open, TLIF or PLIF intervertebral body fusion device with supplemental fixation at one or two levels, the TM Ardis Interbody System is an osteoconductive implant with a minimally invasive, self-distracting design. 

System Features

Indicated for use as an MIS or open, TLIF or PLIF intervertebral body fusion device with supplemental fixation at one or two levels, the TM Ardis Interbody System is an osteoconductive implant with a minimally invasive, self-distracting design.

Enables Bony In-growth

  • Serves as an osteoconductive scaffold for bone growth into the material of the implant and vascularization.1

Provides Initial Stability

  • A high coefficient of friction provides initial stability.2

Delivers Load Sharing Characteristics Similar to Bone3

  • A modulus of elasticity similar to cancellous bone improves load sharing, which has the potential to minimize stress shielding.

Conforms to Varying Patient Anatomy

  • Wide variety of size offerings and convex shape conforms for varying patient anatomy to maximize endplate-implant contact.

Trabecular Metal™ Technology

  • Trabecular Metal Material is a highly porous structure that creates an initial scratch fit and facilitates the long-term biologic attachment of orthopaedic implants via the potential for bony in-growth. 

Specifications

Resources

Additional Information